Invention Grant
- Patent Title: Radiation-sensitive resin composition, resist pattern-forming method, compound and method of generating acid
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Application No.: US16815075Application Date: 2020-03-11
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Publication No.: US11592746B2Publication Date: 2023-02-28
- Inventor: Kazuya Kiriyama , Katsuaki Nishikori , Takuhiro Taniguchi , Ken Maruyama
- Applicant: JSR CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSR CORPORATION
- Current Assignee: JSR CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Element IP, PLC
- Priority: JPJP2019-083410 20190424
- Main IPC: C07C309/06
- IPC: C07C309/06 ; G03F7/039 ; G03F7/004 ; C08L25/06 ; C08L33/06 ; C07C309/12

Abstract:
A radiation-sensitive resin composition contains: a polymer that includes a structural unit including an acid-labile group; and a radiation-sensitive acid generating agent. The radiation-sensitive acid generating agent includes a sulfonate anion and a radiation-sensitive cation. The sulfonate anion includes two or more rings, and an iodine atom and a monovalent group having 0 to 10 carbon atoms which includes at least one of an oxygen atom and a nitrogen atom bond to at least one of the two or more rings. The ring is preferably an aromatic ring. The radiation-sensitive acid generating agent is preferably a compound represented by formula (1). In the formula (1), A1 represents a group obtained from a compound which includes a ring having 3 to 20 ring atoms by removing (p+q+r+1) hydrogen atoms on the ring.
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