Invention Grant
- Patent Title: Information processing apparatus and semiconductor device
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Application No.: US16816366Application Date: 2020-03-12
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Publication No.: US11593151B2Publication Date: 2023-02-28
- Inventor: Yuya Hirayama , Tsutomu Nakaminato , Kenji Kuroishi
- Applicant: FUJIFILM BUSINESS INNOVATION CORP.
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM BUSINESS INNOVATION CORP.
- Current Assignee: FUJIFILM BUSINESS INNOVATION CORP.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2019-124964 20190704
- Main IPC: G06F3/06
- IPC: G06F3/06 ; G06F3/00 ; G06F9/46 ; G06F9/30 ; G06F9/448 ; G06F3/12

Abstract:
A semiconductor device includes three integrated circuits. One of the integrated circuits includes: a first connector configured to connect to a device; and a transmitter. The transmitter is configured to transmit to another integrated circuit, first data on each of a plurality of pieces of packet data. The transmitter is also configured to, when the first connector is connected to the device, while a second controller is performing a second process, transmit, to a first controller, a request to process data transmitted from the device.
Public/Granted literature
- US20210004260A1 INFORMATION PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE Public/Granted day:2021-01-07
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