Invention Grant
- Patent Title: Scalable points-to analysis via multiple slicing
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Application No.: US14757684Application Date: 2015-12-23
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Publication No.: US11593249B2Publication Date: 2023-02-28
- Inventor: Padmanabhan Krishnan , Raghavendra Kagalavadi Ramesh
- Applicant: Oracle International Corporation
- Applicant Address: US CA Redwood Shores
- Assignee: Oracle International Corporation
- Current Assignee: Oracle International Corporation
- Current Assignee Address: US CA Redwood Shores
- Agency: Ferguson Braswell Fraser Kubasta PC
- Main IPC: G06F11/30
- IPC: G06F11/30 ; G06F9/44 ; G06F11/36 ; G06F8/75

Abstract:
A method for analyzing software with pointer analysis may include obtaining a software program, and determining a first independent program slice of the software program describing a first code segment of the software program. The method may further include determining, using a first pointer analysis objective, a first result from performing a first pointer analysis on the first independent program slice, and determining, using the first result, a first dependent program slice of the software program. The method may further include determining, using a second pointer analysis objective, a second result from performing a second pointer analysis on the first dependent program slice. The method may further include generating a report, using these results, indicating whether the software program satisfies a predetermined criterion.
Public/Granted literature
- US20170185504A1 Scalable points-to analysis via multiple slicing Public/Granted day:2017-06-29
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