Invention Grant
- Patent Title: Integrated circuit with thicker metal lines on lower metallization layer
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Application No.: US17404511Application Date: 2021-08-17
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Publication No.: US11593546B2Publication Date: 2023-02-28
- Inventor: Kuang-Hung Chang , Yuan-Te Hou , Chung-Hsing Wang , Yung-Chin Hou
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: G06F30/00
- IPC: G06F30/00 ; G06F30/392 ; G06F30/20 ; G06F30/327 ; H01L23/528 ; H01L27/088 ; G06F30/394

Abstract:
An IC structure includes first, second, third, and fourth transistors on a substrate, a first net and a second net. The first net includes a plurality of first metal lines routed on a first metallization layer, and a plurality of first metal vias electrically connecting the plurality of first metal lines to the first and second transistors. The second net includes a plurality of second metal lines routed on a second metallization layer, and a plurality of second metal vias electrically connecting the plurality of second metal lines to the third and fourth transistors. A total length of the second metal lines of the second net is shorter than a total length of the first metal lines of the first net. A count of the f first metal vias of the first net is less than a count of the second metal vias of the second net.
Public/Granted literature
- US20210390240A1 INTEGRATED CIRCUIT WITH THICKER METAL LINES ON LOWER METALLIZATION LAYER Public/Granted day:2021-12-16
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