Invention Grant
- Patent Title: Electromagnetic apparatus with heat sink structure
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Application No.: US16862534Application Date: 2020-04-29
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Publication No.: US11594360B2Publication Date: 2023-02-28
- Inventor: Chun-Chen Chen , Jian-Hsieng Lee , Feng-Yi Lin , Pang-Chuan Chen
- Applicant: PHIHONG TECHNOLOGY CO., LTD.
- Applicant Address: TW Taoyuan
- Assignee: PHIHONG TECHNOLOGY CO., LTD.
- Current Assignee: PHIHONG TECHNOLOGY CO., LTD.
- Current Assignee Address: TW Taoyuan
- Agency: WPAT, PC
- Priority: TW109105890 20200224
- Main IPC: H01F27/22
- IPC: H01F27/22 ; H01F27/02 ; H01F27/28

Abstract:
The present invention provides an electromagnetic apparatus with heat sink structure, comprising: metal housing, the metal housing further comprises the upper housing and the lower housing to fix the components of the electromagnetic apparatus and store the energy of the electromagnetic apparatus during operation; the electrical coil is mounted on the coil shelf and is provided with numbers of primary windings and secondary windings; the heat conductive tube is arranged in the gap of the windings for conducting the heat generated by the electrical coil to the outside of the electromagnetic apparatus. Furthermore, the conducting wire is electrically coupled to the electrical coil and transmits the input voltage and output voltage during the operation of electromagnetic apparatus.
Public/Granted literature
- US20210265095A1 ELECTROMAGNETIC APPARATUS WITH HEAT SINK STRUCTURE Public/Granted day:2021-08-26
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