Invention Grant
- Patent Title: Electronic component and board having the same mounted thereon
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Application No.: US17208181Application Date: 2021-03-22
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Publication No.: US11594376B2Publication Date: 2023-02-28
- Inventor: Beom Joon Cho , Won Young Jang , Hyeok Jin Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0115241 20200909
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/232 ; H01G2/06 ; H01G4/12 ; H01G4/012

Abstract:
An electronic component and a board having the same mounted thereon are provided. The electronic component includes an electronic component including a capacitor array in which a plurality of multilayer capacitors including a capacitor body and a pair of external electrodes, respectively disposed on both end portions of the capacitor body in a first direction, are stacked in a second direction, perpendicular to the first direction, and a length of a multilayer capacitor, disposed on a lower end in the second direction, in the first direction is less than a length of another multilayer capacitor in the first direction; and a pair of metal frames, respectively disposed to be connected to the pair of external electrodes of the multilayer capacitor disposed on the lower end.
Public/Granted literature
- US20220076890A1 ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON Public/Granted day:2022-03-10
Information query