Invention Grant
- Patent Title: Heterogenous integration for RF, microwave and MM wave systems in photoactive glass substrates
-
Application No.: US17263805Application Date: 2019-12-26
-
Publication No.: US11594457B2Publication Date: 2023-02-28
- Inventor: Jeb H. Flemming , Kyle McWethy
- Applicant: 3D Glass Solutions, Inc.
- Applicant Address: US NM Albuquerque
- Assignee: 3D Glass Solutions, Inc.
- Current Assignee: 3D Glass Solutions, Inc.
- Current Assignee Address: US NM Albuquerque
- Agency: Chalker Flores, LLP
- Agent Edwin S. Flores
- International Application: PCT/US2019/068586 WO 20191226
- International Announcement: WO2020/139951 WO 20200702
- Main IPC: H01L23/051
- IPC: H01L23/051 ; H01L21/48 ; H01L23/544 ; H01L23/66
Abstract:
The present invention includes a method for creating a system in a package with integrated lumped element devices and active devices on a single chip/substrate for heterogeneous integration system-on-chip (HiSoC) in photo-definable glass, comprising: masking a design layout comprising one or more electrical passive and active components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass.
Public/Granted literature
- US20210175136A1 Heterogenous Integration for RF, Microwave and MM Wave Systems in Photoactive Glass Substrates Public/Granted day:2021-06-10
Information query
IPC分类:
