Invention Grant
- Patent Title: Semiconductor devices with string select channel for improved upper connection
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Application No.: US16942456Application Date: 2020-07-29
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Publication No.: US11594544B2Publication Date: 2023-02-28
- Inventor: Hyojoon Ryu , Younghwan Son , Seogoo Kang , Jesuk Moon , Junghoon Jun , Kohji Kanamori , Jeehoon Han
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2019-0145092 20191113
- Main IPC: H01L27/1157
- IPC: H01L27/1157 ; H01L27/11582 ; H01L27/11573 ; H01L27/11565

Abstract:
A semiconductor device includes; gate layers stacked on a substrate, a channel layer extending through the gate layers, a string select gate layer disposed on the channel layer and a string select channel layer extending through the string select gate layer to contact the channel layer. The string select channel layer includes a first portion below the string select gate layer including a first protruding region, a second portion extending through the string select gate layer, and a third portion above the string select gate layer including a second protruding region.
Public/Granted literature
- US20210143160A1 SEMICONDUCTOR DEVICES Public/Granted day:2021-05-13
Information query
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