Invention Grant
- Patent Title: Semiconductor memory device and method for manufacturing semiconductor memory device
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Application No.: US17001232Application Date: 2020-08-24
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Publication No.: US11594551B2Publication Date: 2023-02-28
- Inventor: Moto Yabuki
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2019-171712 20190920
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11565 ; G11C7/18 ; G11C8/14 ; H01L27/1157

Abstract:
A semiconductor memory device according to an embodiment includes: a stacked body alternately stacking first insulating layers and gate electrode layers in a first direction; first to third semiconductor layers in the stacked body extending in the first direction; first to third charge accumulation layers; and a second insulating layer in the stacked body extending in the first direction, the second insulating layer contacting the first semiconductor layer or the first charge accumulation layer in a plane perpendicular to the first direction. A first distance between two end surfaces of the gate electrode layer monotonically increases in the first direction in a first cross section parallel to the first direction. A second distance between two end surfaces of the gate electrode layer monotonically increases in the first direction, decreases, and then monotonically increases in a second cross section parallel to the first direction different from the first cross section.
Public/Granted literature
- US20210091111A1 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2021-03-25
Information query
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