Invention Grant
- Patent Title: Flat panel substrate with integrated antennas and wireless power transmission system
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Application No.: US17478861Application Date: 2021-09-17
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Publication No.: US11594554B2Publication Date: 2023-02-28
- Inventor: Hatem Ibrahim Munir Zeine , Douglas Wayne Williams , Adam W. Oster
- Applicant: Ossia Inc.
- Applicant Address: US WA Redmond
- Assignee: Ossia Inc.
- Current Assignee: Ossia Inc.
- Current Assignee Address: US WA Redmond
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: H02J7/00
- IPC: H02J7/00 ; H01L27/12 ; H02J50/23 ; H01Q21/06 ; H01L23/66 ; H01L23/552 ; H02J50/40

Abstract:
A flat panel substrate with integrated antennas and wireless power transmission system for delivering power to a receiving device is presented herein. A method can comprise depositing, onto a flat panel substrate, an antenna layer comprising multiple adaptively phased antennas elements; and depositing, onto the flat panel substrate, respective thin film transistor (TFT)-based antenna management circuits for the multiple adaptively phased antenna elements—the respective TFT-based antenna management circuits being operable to measure respective first phases at which first signals are received at the multiple adaptively phased antenna elements, and based on the respective first phases, control respective second phases at which second signals are transmitted from the multiple adaptively phased antenna elements to facilitate delivery, via the second signals, of power to the receiving device. Further, the method comprises forming traces communicatively coupling the multiple adaptively phased antenna elements to the respective TFT-based antenna management circuits.
Public/Granted literature
- US20220006325A1 FLAT PANEL SUBSTRATE WITH INTEGRATED ANTENNAS AND WIRELESS POWER TRANSMISSION SYSTEM Public/Granted day:2022-01-06
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