Invention Grant
- Patent Title: Method of implanting dopants into a group III-nitride structure and device formed
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Application No.: US17166775Application Date: 2021-02-03
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Publication No.: US11594606B2Publication Date: 2023-02-28
- Inventor: Han-Chin Chiu , Chi-Ming Chen , Chung-Yi Yu , Chen-Hao Chiang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/66 ; H01L29/778 ; H01L29/20

Abstract:
A method including forming a III-V compound layer on a substrate and implanting a main dopant in the III-V compound layer to form source and drain regions. The method further includes implanting a group V species into the source and drain regions. A semiconductor device including a substrate and a III-V compound layer over the substrate. The semiconductor device further includes source and drain regions in the III-V layer, wherein the source and drain regions comprises a first dopants and a second dopant, and the second dopant comprises a group V material.
Public/Granted literature
- US20210184011A1 Method of Implanting Dopants into a Group III-Nitride Structure and Device Formed Public/Granted day:2021-06-17
Information query
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