Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US17216448Application Date: 2021-03-29
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Publication No.: US11594615B2Publication Date: 2023-02-28
- Inventor: Chao-Ching Cheng , Yu-Lin Yang , Wei-Sheng Yun , Chen-Feng Hsu , Tzu-Chiang Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/423 ; H01L21/02 ; H01L21/306 ; H01L29/04 ; H01L29/08 ; H01L29/786 ; B82Y10/00 ; H01L29/775

Abstract:
A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes semiconductor wires disposed over a substrate, a source/drain epitaxial layer in contact with the semiconductor wires, a gate dielectric layer disposed on and wrapping around each channel region of the semiconductor wires, a gate electrode layer disposed on the gate dielectric layer and wrapping around the each channel region, and dielectric spacers disposed in recesses formed toward the source/drain epitaxial layer.
Public/Granted literature
- US20210242328A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-08-05
Information query
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