Invention Grant
- Patent Title: LDMOS transistor and manufacture thereof
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Application No.: US17352222Application Date: 2021-06-18
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Publication No.: US11594631B2Publication Date: 2023-02-28
- Inventor: Min Li , Min-Hwa Chi , Richard Ru-Gin Chang
- Applicant: SiEn (QingDao) Integrated Circuits Co., Ltd.
- Applicant Address: CN Shandong
- Assignee: SiEn (QingDao) Integrated Circuits Co., Ltd.
- Current Assignee: SiEn (QingDao) Integrated Circuits Co., Ltd.
- Current Assignee Address: CN Shandong
- Agency: Chen Yoshimura LLP
- Priority: CN202010583302.1 20200623
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/66

Abstract:
The present application provides a laterally diffused metal oxide semiconductor (LDMOS) transistor and a manufacturing method thereof. The transistor comprising: a semiconductor substrate having a doping region, wherein the doping region comprises a first well region and a second well region with opposite doping types; a source region, a drain region, a shallow trench isolation (STI) structure comprising a laminated structure having an alternate layers of insulating material and ferroelectric material, a gate, a contact hole, and a metal layer. The LDMOS transistor simultaneously increases breakdown voltage (BV) and reduces on-resistance (Ron).
Public/Granted literature
- US20210399129A1 LDMOS TRANSISTOR AND MANUFACTURE THEREOF Public/Granted day:2021-12-23
Information query
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