Invention Grant
- Patent Title: Conductor assembly structure for rail-type terminal device
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Application No.: US16951295Application Date: 2020-11-18
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Publication No.: US11594829B2Publication Date: 2023-02-28
- Inventor: Chih-Yuan Wu , Biao Huang Hsu
- Applicant: SWITCHLAB INC. , SWITCHLAB (SHANGHAI) CO., LTD. , GAOCHENG ELECTRONICS CO., LTD.
- Applicant Address: TW New Taipei; CN Shanghai; CN Shenzhen
- Assignee: SWITCHLAB INC.,SWITCHLAB (SHANGHAI) CO., LTD.,GAOCHENG ELECTRONICS CO., LTD.
- Current Assignee: SWITCHLAB INC.,SWITCHLAB (SHANGHAI) CO., LTD.,GAOCHENG ELECTRONICS CO., LTD.
- Current Assignee Address: TW New Taipei; CN Shanghai; CN Shenzhen
- Agency: Rosenberg, Klein & Lee
- Priority: TW108142161 20191120
- Main IPC: H01R9/26
- IPC: H01R9/26 ; H01R4/36 ; H01R4/48 ; H01R13/40 ; H01R13/627

Abstract:
A conductor assembly structure for a rail-type terminal device includes a conductor assembly and an insulating housing. The conductor assembly structure can reduce manufacturing waste and has a larger contact surface and a better electric conduction effect. The conductor assembly has a base portion that can be pivotally connected with a conductive connector, and a first area and a second area connected to the base portion. The first area and the second area are respectively formed with a bowed portion and a first section and a second section connected to the bowed portion to be snapped onto a grounding mounting rail. At least one of the first area and the second area is provided with a load arm and an elastic member connected to the load arm for increasing the elastic fixing effect (force) of the first section and/or the second section on the grounding mounting rail.
Public/Granted literature
- US20210151911A1 CONDUCTOR ASSEMBLY STRUCTURE FOR RAIL-TYPE TERMINAL DEVICE Public/Granted day:2021-05-20
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