Invention Grant
- Patent Title: Solid-state image pickup apparatus, correction method, and electronic apparatus
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Application No.: US17090666Application Date: 2020-11-05
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Publication No.: US11595603B2Publication Date: 2023-02-28
- Inventor: Takeru Tsuzuki , Katsumi Nishikori
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JP2016-133966 20160706
- Main IPC: H04N5/369
- IPC: H04N5/369 ; H01L27/146 ; H04N5/357 ; H04N5/365 ; H04N5/232

Abstract:
The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.
Public/Granted literature
- US11632603B2 Solid-state image pickup apparatus, correction method, and electronic apparatus Public/Granted day:2023-04-18
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