Invention Grant
- Patent Title: Method of producing printed circuit boards with routing conductors and dielectric strands
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Application No.: US16670374Application Date: 2019-10-31
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Publication No.: US11596054B2Publication Date: 2023-02-28
- Inventor: Yanyan Zhang , Lloyd Andre Walls , Jinwoo Choi , Mehdi Mohamed Mechaik
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Lieberman & Brandsdorfer, LLC
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K1/02 ; H05K1/03 ; H01B3/08

Abstract:
Embodiments are directed to a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material and an intermediate or second layer adjacently positioned with respect to the dielectric material. The intermediate layer or second layer includes a conductor and fiberglass strands, with the fiberglass strands having an associated orientation. When assembled, the fiberglass and the conductor have a matching orientation and separation distance from a source to a destination.
Public/Granted literature
- US20200092980A1 Printed Circuit Board with Routing of a Conductor and Dielectric Strands Public/Granted day:2020-03-19
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