Invention Grant
- Patent Title: Stretchable wiring member
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Application No.: US15734021Application Date: 2019-06-28
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Publication No.: US11596061B2Publication Date: 2023-02-28
- Inventor: Takaya Kimoto
- Applicant: SEKISUI POLYMATECH CO., LTD.
- Applicant Address: JP Saitama
- Assignee: SEKISUI POLYMATECH CO., LTD.
- Current Assignee: SEKISUI POLYMATECH CO., LTD.
- Current Assignee Address: JP Saitama
- Agency: Cermak Nakajima & McGowan LLP
- Agent Tomoko Nakajima
- Priority: JPJP2018-122745 20180628
- International Application: PCT/JP2019/025973 WO 20190628
- International Announcement: WO2020/004660 WO 20200102
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/09 ; H05K1/11 ; A61B5/268 ; H05K1/03 ; H05K1/18

Abstract:
In a stretchable wiring member having a relatively hard portion, such as a contact point, there is provided a solution to malfunction of the stretchable wiring member caused by stress generated at a boundary between the hard portion and a flexible portion. A stretchable wiring member includes a flexible substrate having stretchability, a stretchable wiring line disposed along the flexible substrate and configured to be stretched in association with stretching deformation of the flexible substrate, and a hard member that is harder than the flexible substrate. The flexible substrate has an extension layer portion interposed between the hard member and the stretchable wiring line.
Public/Granted literature
- US20210227689A1 Stretchable Wiring Member Public/Granted day:2021-07-22
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