Invention Grant
- Patent Title: Apparatus for depositing conductive and nonconductive material to form a printed circuit
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Application No.: US16773944Application Date: 2020-01-27
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Publication No.: US11596071B2Publication Date: 2023-02-28
- Inventor: Michael Knox , Andrew Ippoliti , Georgios Kyriakou , Carlos Ospina , Nicolas Vansnick
- Applicant: BotFactory Inc.
- Applicant Address: US NY Long Island City
- Assignee: BotFactory Inc.
- Current Assignee: BotFactory Inc.
- Current Assignee Address: US NY Long Island City
- Agent Herbert F. Ruschmann
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K3/12 ; G01R31/28

Abstract:
An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to convert PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. The apparatus has a testing head to verify conductors which operates automatically. The translation module also prints nonconductive material component alignment areas and nonconductive material substrate stiffeners.
Public/Granted literature
- US20200163220A1 APPARATUS FOR DEPOSITING CONDUCTIVE AND NONCONDUCTIVE MATERIAL TO FORM A PRINTED CIRCUIT Public/Granted day:2020-05-21
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