Invention Grant
- Patent Title: Thermal module with heat pipe having a sharp angled bend for increased cooling
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Application No.: US17241932Application Date: 2021-04-27
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Publication No.: US11596084B2Publication Date: 2023-02-28
- Inventor: Qinghong He , Travis North
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: McDermott Will & Emery LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A thermal module with a heat pipe configured with a first portion configured for contact with an edge of a plurality of fins in a fin stack, a second portion configured for contact with a side of one fin in the fin stack and a sharp angled bend is formed between the first portion and the second portion to fluidly isolate the first portion from the second portion. The first portion comprises a usable length of the heat pipe that efficiently transfers heat based on phase transitioning by the fluid. The second portion is formed from at least some of the unusable length of the heat pipe. By configuring the heat pipe such that more fins contact the usable length of the heat pipe, heat transfer from the heat pipe to the fin stack is increased.
Public/Granted literature
- US20220346275A1 THERMAL MODULE WITH HEAT PIPE HAVING A SHARP ANGLED BEND FOR INCREASED COOLING Public/Granted day:2022-10-27
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