Invention Grant
- Patent Title: Component mounter, component mounting line, and manufacturing method of mounting board
-
Application No.: US16182674Application Date: 2018-11-07
-
Publication No.: US11596091B2Publication Date: 2023-02-28
- Inventor: Junkei Shimizu , Takeyuki Kawase
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JPJP2017-227367 20171128
- Main IPC: H05K13/08
- IPC: H05K13/08 ; H05K13/00

Abstract:
There is provided a component mounter including: a plurality of transport lanes for transporting a board sorted by a board sorting device; a congestion index calculator for calculating a congestion index indicating a congestion degree of each of the plurality of transport lanes; a transport lane determiner for determining a transport lane for carrying in the board among the plurality of transport lanes based on the calculated congestion index; and an outputter for outputting a board request signal for requesting to carry the board into the transport lane determined by the transport lane determiner, to the board sorting device.
Public/Granted literature
- US20190166736A1 COMPONENT MOUNTER, COMPONENT MOUNTING LINE, AND MANUFACTURING METHOD OF MOUNTING BOARD Public/Granted day:2019-05-30
Information query