Invention Grant
- Patent Title: Enhanced wireless communication and power transfer between external and implanted devices
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Application No.: US16722593Application Date: 2019-12-20
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Publication No.: US11596794B2Publication Date: 2023-03-07
- Inventor: Alexander Yeh , Hui Zhang , Thomas Burpee Ellsworth, III
- Applicant: NeuSpera Medical Inc.
- Applicant Address: US CA San Jose
- Assignee: NeuSpera Medical Inc.
- Current Assignee: NeuSpera Medical Inc.
- Current Assignee Address: US CA San Jose
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: A61N1/00
- IPC: A61N1/00 ; A61N1/36 ; A61N1/375 ; H02J50/20 ; A61N1/08 ; H01G4/35 ; H01Q1/38 ; A61N1/372 ; A61N1/378 ; A61N1/05 ; A61N1/02

Abstract:
Systems, devices, and methods are discussed herein for wirelessly transmitting power and/or data to an implanted device, such as an implanted electrostimulator device. In an example, the subject matter includes a layered transmitter device with multiple conductive planes and excitation features. The transmitter device can be tuned to identify and apply device parameters for efficient wireless communication with a deeply implanted device. The transmitter is generally configured for midfield powering applications by providing signals that give rise to propagating signals inside of body tissue.
Public/Granted literature
- US20200155843A1 Enhanced wireless communication and power transfer between external and implanted devices Public/Granted day:2020-05-21
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