Invention Grant
- Patent Title: Welding structure, wiring board with metal piece, and welding method
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Application No.: US16650726Application Date: 2018-12-27
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Publication No.: US11597038B2Publication Date: 2023-03-07
- Inventor: Yoshiharu Doi , Toshitaka Namba , Kenji Takahashi
- Applicant: Fujikura Ltd.
- Applicant Address: JP Tokyo
- Assignee: Fujikura Ltd.
- Current Assignee: Fujikura Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JPJP2017-253541 20171228
- International Application: PCT/JP2018/048031 WO 20181227
- International Announcement: WO2019/131828 WO 20190704
- Main IPC: B23K26/323
- IPC: B23K26/323 ; B23K26/28 ; H01R4/02 ; H01R12/59 ; H01R43/02 ; B23K103/20 ; B23K103/22
Abstract:
A welding structure includes: a first metal member and a second metal member that are superimposed and welded together. The first metal member has a hole. The second metal member includes a nugget portion where a part of the second metal member has been melted by heat of laser light and has re-solidified. A peripheral portion of the hole in the first metal member covers the nugget portion. A part of the nugget portion is exposed through the hole.
Public/Granted literature
- US20200306882A1 WELDING STRUCTURE, WIRING BOARD WITH METAL PIECE, AND WELDING METHOD Public/Granted day:2020-10-01
Information query
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