Invention Grant
- Patent Title: Component mounting system
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Application No.: US17051318Application Date: 2018-05-30
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Publication No.: US11597100B2Publication Date: 2023-03-07
- Inventor: Kenzo Ishikawa , Jun Iisaka , Hidetoshi Ito
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2018/020808 WO 20180530
- International Announcement: WO2019/229884 WO 20191205
- Main IPC: B25J15/06
- IPC: B25J15/06 ; B25J9/16 ; B25J13/08 ; B25J15/00 ; H05K13/04 ; H05K13/08

Abstract:
A component mounting system includes a head to revolve multiple suction nozzles in a circumferential direction, a lifting and lowering device configured to lift and lower a suction nozzle at a predetermined revolving position, a storage device configured to store any one of multiple pieces of directionality information in association with identification information of the suction nozzle, and a control device configured to acquire corresponding directionality information from the storage device based on the acquired identification information of the suction nozzle and to perform pickup of the component supplied from the component supply device at the spinning position in accordance with the directionality information.
Public/Granted literature
- US20210237282A1 COMPONENT MOUNTING SYSTEM Public/Granted day:2021-08-05
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