Invention Grant
- Patent Title: Thin-layer tape automated lamination method and device
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Application No.: US16648331Application Date: 2019-10-03
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Publication No.: US11597168B2Publication Date: 2023-03-07
- Inventor: Kazumasa Kawabe , Kohei Yamada , Keiichi Kondo , Hirofumi Iyo , Shin Kaechi
- Applicant: FUKUI PREFECTURAL GOVERNMENT
- Applicant Address: JP Fukui
- Assignee: FUKUI PREFECTURAL GOVERNMENT
- Current Assignee: FUKUI PREFECTURAL GOVERNMENT
- Current Assignee Address: JP Fukui
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2018-189770 20181005,JPJP2018-189771 20181005
- International Application: PCT/JP2019/039049 WO 20191003
- International Announcement: WO2020/071466 WO 20200409
- Main IPC: B29C70/38
- IPC: B29C70/38 ; B29C70/34 ; B29C70/54

Abstract:
The present invention is intended to provide automated lamination method and device that can efficiently perform automated lamination by using a thin-layer tape. A thin-layer tape automated lamination device 1 includes a provisional formation unit 2 configured to form lamination tapes having thicknesses different from each other by laminating a plurality of thin-layer tapes each having a thickness of 5 μm to 80 μm, and a lamination-shaping unit 3 configured to laminate and shape each formed lamination tape in a lamination region of a basal body surface.
Public/Granted literature
- US20210206122A1 THIN-LAYER TAPE AUTOMATED LAMINATION METHOD AND DEVICE Public/Granted day:2021-07-08
Information query
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