The present disclosure relates to a film for bonding including an embossed surface, wherein the embossed surface has a Sku value of 5 or less, wherein the embossed surface has Sk, Spk, and Svk values, and when a total sum of the Sk value, the Spk value, and the Svk value is 100%, a sum of the Sk value and the Spk value is 50% or more, wherein the embossed surface has a Sz value of 30 to 90 μm, and wherein the film includes a polyvinyl acetal resin and a plasticizer.