Invention Grant
- Patent Title: Method for producing thermally conductive sheet
-
Application No.: US17424596Application Date: 2020-01-21
-
Publication No.: US11597196B2Publication Date: 2023-03-07
- Inventor: Yusuke Kubo , Keisuke Aramaki
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Shimotsuke
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Shimotsuke
- Agency: Element IP, PLC
- Priority: JPJP2019-011143 20190125
- International Application: PCT/JP2020/001907 WO 20200121
- International Announcement: WO2020/153346 WO 20200730
- Main IPC: B32B37/18
- IPC: B32B37/18 ; B32B7/027 ; B29C70/58 ; B32B27/20 ; B32B27/28 ; B29K83/00 ; B29K307/04 ; B29L7/00 ; F28F21/06 ; H01L23/373

Abstract:
A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C.·cm2/W or less.
Public/Granted literature
- US20220080718A1 METHOD FOR PRODUCING THERMALLY CONDUCTIVE SHEET Public/Granted day:2022-03-17
Information query