Invention Grant
- Patent Title: Bonded structure, imaging apparatus, and moveable body
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Application No.: US16973187Application Date: 2019-05-24
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Publication No.: US11597331B2Publication Date: 2023-03-07
- Inventor: Hiroyuki Abe , Takahiro Okada
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Studebaker & Brackett PC
- Priority: JPJP2018-122336 20180627
- International Application: PCT/JP2019/020746 WO 20190524
- International Announcement: WO2020/003838 WO 20200102
- Main IPC: B60R11/04
- IPC: B60R11/04 ; H04N5/225 ; B64D47/08

Abstract:
A bonded structure (14) includes a first member (15), a second member (16), and an adhesive body (17). The second member (16) includes a support (18). The support (18) includes a facing surface and a side surface. The facing surface faces the first member (15). The side surface is inclined outward as viewed from the first member side. The adhesive body (17) is located between the first member (15) and the second member (16). The adhesive body (17) extends from the facing surface to the side surface. The adhesive body (17) has a fillet shape at an end thereof by the side surface. The adhesive body (17) fixes the first member (15) to the second member (16).
Public/Granted literature
- US20210261068A1 BONDED STRUCTURE, IMAGING APPARATUS, AND MOVEABLE BODY Public/Granted day:2021-08-26
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