Photocurable composition for making layers with high etch resistance
Abstract:
A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material can comprise at least one acrylate monomer including at least one cyano group (CN-acrylate monomer). The presence of a low amount of the CN-acrylate monomer between 10 wt % and not greater than 30 wt % can lower the contact angle of the composition and may improve the etch resistance of a photo-cured layer made from the photocurable composition.
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