Invention Grant
- Patent Title: Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same
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Application No.: US17052488Application Date: 2020-01-17
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Publication No.: US11597837B2Publication Date: 2023-03-07
- Inventor: Changbo Shim , Yongseon Hwang , Hwayeon Moon , Hee Yong Shim , Hyunsung Min
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2019-0015098 20190208
- International Application: PCT/KR2020/000872 WO 20200117
- International Announcement: WO2020/162668 WO 20200813
- Main IPC: C08K3/36
- IPC: C08K3/36 ; C08L71/12 ; B32B5/02 ; B32B15/14 ; B32B15/20 ; H01L23/14 ; H01L23/498 ; C08K9/04 ; C08J5/24
Abstract:
The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.
Public/Granted literature
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