Invention Grant
- Patent Title: Cleaning liquid, cleaning method, and method for producing semiconductor wafer
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Application No.: US17178827Application Date: 2021-02-18
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Publication No.: US11597896B2Publication Date: 2023-03-07
- Inventor: Toshiaki Shibata , Yasuhiro Kawase , Ken Harada , Atsushi Ito , Tomohiro Kusano , Yutaro Takeshita
- Applicant: Mitsubishi Chemical Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Chemical Corporation
- Current Assignee: Mitsubishi Chemical Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2018-161077 20180830
- Main IPC: C11D11/00
- IPC: C11D11/00 ; C11D7/32 ; C11D7/26 ; H01L21/02
Abstract:
The present invention relates to a cleaning liquid containing a component (A): a compound represented by the following formula (1), component (B): alkylamine, component (C): polycarboxylic acid, and component (D): ascorbic acid, in which a mass ratio of the component (A) to a total mass of the component (B) and the component (C) is 1 to 15, and in the formula (1), R1, R2, and R3 each have a definition same as the definition described in the description,
Public/Granted literature
- US20210171878A1 CLEANING LIQUID, CLEANING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR WAFER Public/Granted day:2021-06-10
Information query
