Invention Grant
- Patent Title: High retention force serviceable plug-on joint assembly
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Application No.: US17815833Application Date: 2022-07-28
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Publication No.: US11598376B2Publication Date: 2023-03-07
- Inventor: Michael Walter Hopson , Arvind Srinivasan , Michael Peter Kinsella
- Applicant: NEAPCO INTELLECTUAL PROPERTY HOLDINGS, LLC
- Applicant Address: US MI Farmington Hills
- Assignee: NEAPCO INTELLECTUAL PROPERTY HOLDINGS, LLC
- Current Assignee: NEAPCO INTELLECTUAL PROPERTY HOLDINGS, LLC
- Current Assignee Address: US MI Farmington Hills
- Agency: Shumaker, Loop & Kendrick, LLP
- Agent James D. Miller
- Main IPC: F16D1/116
- IPC: F16D1/116 ; F16B21/18 ; F16D1/10 ; F16D3/223

Abstract:
A joint assembly includes a first member having splines formed therein. A second member includes splines formed thereon and is coupled to the first member. The splines of the first member engage the splines of the second member. An access window is formed on the first member. A ring retains the first member to the second member. A seal extends across a joint between the first member and the second member and covers the access window. A portion of the ring is accessible through the access window following removal of the seal, where the ring can be manipulated to release the first member from the second member.
Public/Granted literature
- US20220364607A1 HIGH RETENTION FORCE SERVICEABLE PLUG-ON JOINT ASSEMBLY Public/Granted day:2022-11-17
Information query
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