Invention Grant
- Patent Title: Heat pipe thermal transfer loop with pumped return conduit
-
Application No.: US16952474Application Date: 2020-11-19
-
Publication No.: US11598550B2Publication Date: 2023-03-07
- Inventor: Hussam Jouhara
- Applicant: BRUNEL UNIVERSITY LONDON
- Applicant Address: GB Uxbridge
- Assignee: BRUNEL UNIVERSITY LONDON
- Current Assignee: BRUNEL UNIVERSITY LONDON
- Current Assignee Address: GB Uxbridge
- Agency: Cook Alex Ltd.
- Priority: GB1809208 20180605
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F24F12/00 ; F28D15/02

Abstract:
A heat pipe system including a heat pipe having a first end and a second end for transferring working fluid from the first to the second end, a first reservoir in fluid communication with the first end for holding working fluid in liquid form, a first heat exchanger for transmitting thermal energy from a heat source to working fluid in the first reservoir to vaporize the fluid, a second heat exchanger for transmitting thermal energy from vaporized working fluid to a heat sink thereby condensing the fluid, a return conduit and a pump for pumping the condensed working fluid along the return conduit, where the heat pipe, the return conduit and the first reservoir form a hermetically sealed circuit. A method of transferring thermal energy using a heat pipe system is also disclosed.
Public/Granted literature
- US20210071900A1 Thermal Transfer Loop Public/Granted day:2021-03-11
Information query