Invention Grant
- Patent Title: Heat source-side unit and refrigeration apparatus
-
Application No.: US17684109Application Date: 2022-03-01
-
Publication No.: US11598559B2Publication Date: 2023-03-07
- Inventor: Masaaki Takegami , Shuichi Taguchi
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2019-180391 20190930
- Main IPC: F25B1/10
- IPC: F25B1/10 ; F25B9/00

Abstract:
A heat source-side unit (10) includes a heat source-side circuit (11). The heat source-side circuit (11) includes a compression unit (20) including a lower-stage compression element (23) and a higher-stage compression element (21), an intermediate heat exchanger (17) disposed on a refrigerant path between the lower-stage compression element (23) and the higher-stage compression element (21), and a bypass passage (23c) connected to a suction pipe (23a) and a discharge pipe (23b) each connected to the lower-stage compression element (23). At startup of the compression unit (20), a first action is performed for stopping the lower-stage compression element (23) and operating the higher-stage compression element (21). This configuration thus suppresses occurrence of liquid compression at startup of a compressor.
Public/Granted literature
- US20220186987A1 HEAT SOURCE-SIDE UNIT AND REFRIGERATION APPARATUS Public/Granted day:2022-06-16
Information query