Invention Grant
- Patent Title: Apparatus and method for deformation measurement
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Application No.: US17008333Application Date: 2020-08-31
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Publication No.: US11598625B2Publication Date: 2023-03-07
- Inventor: Hsuan-Yu Chen , Ming-Han Wang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: G01B7/16
- IPC: G01B7/16 ; G01N1/44
Abstract:
An apparatus for deformation measurement and a method for deformation measurement are provided. The apparatus includes a housing, a sample holder, a moving mechanism, a first heating device and a second heating device. The sample holder is in the housing. The moving mechanism is over the sample holder. The first heating device is on the moving mechanism. The second heating device is below the sample holder.
Public/Granted literature
- US20220065608A1 APPARATUS AND METHOD FOR DEFORMATION MEASUREMENT Public/Granted day:2022-03-03
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