An apparatus and a method for measuring a creep crack growth property using a small specimen with a micro groove are provided. The apparatus for measuring a creep crack growth property includes a lower die on which an edge of the specimen is mounted and which includes a lower die hole formed in the center thereof, an upper die coupled to an upper portion of the lower die so as to fix the specimen, and a punching unit inserted into an upper die hole formed in the center of the upper die so as to press an upper surface of the specimen, wherein a semielliptical micro groove is formed in a lower surface of the specimen to measure a creep crack growth property.