Invention Grant
- Patent Title: Dynamic generation of layout adaptive packaging
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Application No.: US17285741Application Date: 2019-08-28
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Publication No.: US11599032B2Publication Date: 2023-03-07
- Inventor: Uwe Hollerbach , Thomas L. Laidig
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- International Application: PCT/US2019/048627 WO 20190828
- International Announcement: WO2020/101786 WO 20200522
- Main IPC: G03F7/20
- IPC: G03F7/20 ; H01L21/027
Abstract:
Aspects of disclosure provide a method for attaching wiring connections to a component using both design and field measured data of the component to produce accurate wiring connections.
Public/Granted literature
- US20210341849A1 DYNAMIC GENERATION OF LAYOUT ADAPTIVE PACKAGING Public/Granted day:2021-11-04
Information query
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