Invention Grant
- Patent Title: Hinge module and electronic device
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Application No.: US17027716Application Date: 2020-09-22
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Publication No.: US11599157B2Publication Date: 2023-03-07
- Inventor: Cheng-Shiue Jan , Jyh-Chyang Tzou , I Ta Tsai , Meng Ju Wu
- Applicant: Cheng-Shiue Jan , Jyh-Chyang Tzou , I Ta Tsai , Meng Ju Wu
- Applicant Address: TW Taipei; TW Taipei; TW Taipei; TW Taipei
- Assignee: Cheng-Shiue Jan,Jyh-Chyang Tzou,I Ta Tsai,Meng Ju Wu
- Current Assignee: Cheng-Shiue Jan,Jyh-Chyang Tzou,I Ta Tsai,Meng Ju Wu
- Current Assignee Address: TW Taipei; TW Taipei; TW Taipei; TW Taipei
- Agency: JCIPRNET
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/02

Abstract:
A hinge module is provided, including a positioning assembly, a first shaft, a second shaft, a first bracket, a second bracket, and a switching assembly. The first shaft has a first rotating part and a first installing part. The first rotating part is rotatably disposed through the positioning assembly. The second shaft has a second rotating part and a second installing part. The second rotating part is rotatably disposed through the positioning assembly. The first bracket is disposed on the first installing part of the first shaft. The second bracket is disposed on the second installing part of the second shaft. The switching assembly is movably disposed in the positioning assembly and abuts between the first shaft and the second shaft. The hinge module is adapted to switch between a closed state, a first unfolded state, and a second unfolded state.
Public/Granted literature
- US20210325938A1 HINGE MODULE AND ELECTRONIC DEVICE Public/Granted day:2021-10-21
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