Invention Grant
- Patent Title: Connection structure of inductive element
-
Application No.: US16145894Application Date: 2018-09-28
-
Publication No.: US11600422B2Publication Date: 2023-03-07
- Inventor: Lei-Ming Lee , Xin-Hung Lin
- Applicant: DELTA ELECTRONICS, INC.
- Applicant Address: TW Taoyuan
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201810542419.8 20180530
- Main IPC: H01F27/02
- IPC: H01F27/02 ; H01F27/06 ; H01F27/28 ; H05K5/00 ; H01R4/50

Abstract:
A connection structure of an inductive element includes a circuit substrate, in inductive element, at least one connection wire, a supporting element, a containing element, a positioning element, a connecting element, and a locking element. The circuit substrate has a through hole. Each connection wire has a first end connected to the inductive element, and a fixed terminal is disposed on a second end of the connection wire. The containing element is formed on the supporting element to provide a containing space. The positioning element is contained in the containing space, and provides a positioning part. The connecting element has a first connecting part and a second connecting part. The first connecting part is connected to the positioning part to clip the fixed terminal. The locking element has a locking part. The locking part is connected to the second connecting part to lock on the circuit substrate.
Information query