Invention Grant
- Patent Title: Coil component
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Application No.: US16666965Application Date: 2019-10-29
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Publication No.: US11600427B2Publication Date: 2023-03-07
- Inventor: Kwang Il Park , Jong Min Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0040209 20190405
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/29 ; H01F41/04 ; H01F41/02 ; H01F27/245

Abstract:
A coil component includes a body having a first surface and a second surface facing each other, and having a plurality of wall surfaces connecting the first surface to the second surface; an insulating substrate; a coil portion comprising a first lead-out pattern and a second lead-out pattern each covered with the body and disposed on the insulating substrate; a first external electrode and a second external electrode disposed on the first surface of the body and spaced apart from each other; a first connection electrode and a second connection electrode respectively extending from the first and second lead-out patterns to the first and second external electrodes; and a first support portion and a second support portion respectively extending from the coil portion to be exposed to one of the plurality of wall surfaces, and respectively disposed to be spaced apart from the first and second lead-out patterns.
Public/Granted literature
- US20200321155A1 COIL COMPONENT Public/Granted day:2020-10-08
Information query