Invention Grant
- Patent Title: Inductor including high-rigidity insulating layers
-
Application No.: US16984590Application Date: 2020-08-04
-
Publication No.: US11600430B2Publication Date: 2023-03-07
- Inventor: Jong Yoon Jang , Seok Hwan Ahn , Jeong Min Cho , Tae Hoon Kim , Jin Gul Hyun , Se Woong Paeng
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0110571 20160830,KR10-2017-0009248 20170119
- Main IPC: H01F27/00
- IPC: H01F27/00 ; H01F27/28 ; H01F17/00 ; H01F41/04 ; H01F27/32 ; H01F27/29 ; H01F41/12

Abstract:
There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F27/00 | 变压器或电感器的一般零部件 |