Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US17222550Application Date: 2021-04-05
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Publication No.: US11600441B2Publication Date: 2023-03-07
- Inventor: Seung Min Kang , Ho Sam Choi , Jong Ho Lee , So Hyeon Hong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0143502 20201030
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/008 ; H01G4/012 ; H01G4/30

Abstract:
A multilayer electronic component includes a body including dielectric layers and internal electrodes. The internal electrodes are exposed to fifth and sixth surfaces of the body, and first ends thereof are respectively exposed to third or fourth surfaces of the body. First and second side margin portions are respectively disposed on the fifth and sixth surfaces. The body includes an active portion, and upper and lower cover portions disposed respectively on a first surface and a second surface of the active portion in a first direction. The ratio of a dimension of the lower cover portion in the first direction C to a dimension of the first side margin portion in the third direction A, C/A≥2.6, C/T is 0.080, where T is a dimension of the body in the first direction, and D
Public/Granted literature
- US20220139622A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2022-05-05
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