- Patent Title: Method for manufacturing a multilayer ceramic electronic component
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Application No.: US17016687Application Date: 2020-09-10
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Publication No.: US11600445B2Publication Date: 2023-03-07
- Inventor: Yusuke Yokota , Togo Matsui
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2019-170411 20190919
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/232 ; H01G13/00 ; H01G4/248 ; H01G4/252

Abstract:
A multilayer ceramic electronic component includes a multilayer body including two major surfaces opposite to each other in a layer stacking direction, two side surfaces opposite to each other in a widthwise direction orthogonal or substantially orthogonal to the layer stacking direction, and two end surfaces opposite to each other in a lengthwise direction orthogonal or substantially orthogonal to the layer stacking direction and the widthwise direction, and external electrodes provided on the two end surfaces. A method for manufacturing the multilayer ceramic capacitor component includes preparing a plurality of multilayer bodies, stacking the plurality of multilayer bodies via a binder, rotating the plurality of multilayer bodies by about 90° with the lengthwise direction defining and functioning as an axis of rotation, and providing a side gap portion; and removing the binder from the multilayer body provided with the side gap portion.
Public/Granted literature
- US20210090811A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-03-25
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