Invention Grant
- Patent Title: Contact assembly for electrical devices and method for making
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Application No.: US16600455Application Date: 2019-10-12
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Publication No.: US11600454B2Publication Date: 2023-03-07
- Inventor: Katherine Marjorie Coughlin , Leonardo Ajdelsztajn , Jeffrey Jon Schoonover , Samuel Stephen Kim , Linda Yvonne Jacobs , Maxime Michel Pean
- Applicant: ABB Schweiz AG
- Applicant Address: CH Baden
- Assignee: ABB Schweiz AG
- Current Assignee: ABB Schweiz AG
- Current Assignee Address: CH Baden
- Agency: Armstrong Teasdale LLP
- Main IPC: H01H1/021
- IPC: H01H1/021 ; C23C24/04 ; H01H11/04 ; H01H1/0233 ; H01H1/025

Abstract:
A contact assembly for an electrical device and a method for making such an assembly are presented. The contact assembly comprises a substrate and a contact material disposed on the substrate. The contact material comprises a composite material comprising a refractory material and a matrix material. The matrix material has a higher ductility than the refractory material. The composite material further comprises a core region and an outer region bounding the core region, the core region having a higher concentration of the refractory material than the outer region. The method applies cold spraying a blended feedstock to produce a layer that includes the composite material described above.
Public/Granted literature
- US20200043675A1 CONTACT ASSEMBLY FOR ELECTRICAL DEVICES AND METHOD FOR MAKING Public/Granted day:2020-02-06
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