Invention Grant
- Patent Title: Cleaning method, semiconductor manufacturing method and a system thereof
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Application No.: US16548824Application Date: 2019-08-22
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Publication No.: US11600484B2Publication Date: 2023-03-07
- Inventor: Shao-Chi Wei , Hao-Ming Chang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT Law
- Agent Anthony King
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B08B7/00 ; H01L21/027 ; H01L21/67
Abstract:
A cleaning method applied in semiconductor manufacturing is provided. The method includes: receiving a substrate having a surface; identifying a location of a particle on the surface of the substrate; moving a cleaning apparatus toward the location of the particle; performing a cleaning operation, thereby removing the particle by spraying a cleaning liquid from the cleaning apparatus flowing against gravity and toward the surface of the substrate; detecting the surface of the substrate; and performing a second cleaning operation when a cleaning result of the detection is not acceptable. A semiconductor manufacturing method and a system for cleaning a substrate are also provided.
Public/Granted literature
- US20210057209A1 CLEANING METHOD, SEMICONDUCTOR MANUFACTURING METHOD AND A SYSTEM THEREOF Public/Granted day:2021-02-25
Information query
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