Invention Grant
- Patent Title: Substrate cleaning method, substrate cleaning system, and storage medium
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Application No.: US17255029Application Date: 2019-06-13
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Publication No.: US11600499B2Publication Date: 2023-03-07
- Inventor: Meitoku Aibara
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2018-122318 20180627
- International Application: PCT/JP2019/023391 WO 20190613
- International Announcement: WO2020/004047 WO 20200102
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02
Abstract:
A substrate cleaning method according to an aspect of the present disclosure includes: supplying a film-forming treatment liquid containing a volatile component to a substrate to form a film on the substrate; supplying a peeling treatment liquid, which peels off a treatment film from the substrate, to the treatment film formed by solidifying or curing the film-forming treatment liquid on the substrate due to volatilization of the volatile component; and supplying a hydrophobic liquid, which hydrophobizes the substrate, to the substrate to which the peeling treatment liquid has been supplied.
Public/Granted literature
- US20210265180A1 SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM, AND STORAGE MEDIUM Public/Granted day:2021-08-26
Information query
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