Invention Grant
- Patent Title: Micro pick up array and manufacturing method thereof
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Application No.: US16154733Application Date: 2018-10-09
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Publication No.: US11600509B2Publication Date: 2023-03-07
- Inventor: Ze-Yu Yen , Yi-Fen Lan , Ho-Cheng Lee , Tsung-Tien Wu
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW106135572 20171018
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/683 ; H01L21/768 ; B81C99/00 ; H01L21/67 ; B81C1/00
Abstract:
A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.
Public/Granted literature
- US20190115242A1 MICRO PICK UP ARRAY AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-04-18
Information query
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