Invention Grant
- Patent Title: Substrate holding device
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Application No.: US16630963Application Date: 2018-06-25
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Publication No.: US11600514B2Publication Date: 2023-03-07
- Inventor: Masaki Tomita , Junitsu Yamakawa
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: BakerHostetler
- Priority: JPJP2017-137924 20170714
- International Application: PCT/JP2018/023930 WO 20180625
- International Announcement: WO2019/012967 WO 20190117
- Main IPC: H01L21/683
- IPC: H01L21/683 ; B25J15/06 ; B65G49/06 ; C25D17/06 ; H01L21/67

Abstract:
Provided is a substrate holding device that inhibits drop in holding accuracy of a substrate. A Bernoulli chucking pad suctions and holds a front surface or a back surface of a substrate S. A position determiner 54 is capable of pushing the substrate S in contact with a side surface 82 of the substrate S, and positioning the suctioned substrate S. A pin 66 enables the position determiner 54 to come in contact with the side surface 82 of the substrate S. The pin 66 brings the position determiner 54 into contact with the side surface 82 of the substrate S, and the position determiner 54 thereby positions the substrate S.
Public/Granted literature
- US20200258768A1 SUBSTRATE HOLDING DEVICE Public/Granted day:2020-08-13
Information query
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