Invention Grant
- Patent Title: Screwless semiconductor processing chambers
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Application No.: US16541450Application Date: 2019-08-15
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Publication No.: US11600517B2Publication Date: 2023-03-07
- Inventor: Bo-Ru Chen , Yan-Hong Liu , Che-Fu Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Duane Morris LLP
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/683 ; C23C16/458 ; H01J37/32 ; H01L21/768 ; C23C16/455
Abstract:
In an embodiment, a system includes: a gas distributor assembly configured to dispense gas into a chamber; and a chuck assembly configured to secure a wafer within the chamber, wherein at least one of the gas distributor assembly and the chuck assembly includes: a first portion comprising a convex protrusion, and a second portion comprising a concave opening, wherein the convex protrusion is configured to engage the concave opening.
Public/Granted literature
- US20200075402A1 SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS Public/Granted day:2020-03-05
Information query
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