Invention Grant
- Patent Title: Dimension measurement apparatus, dimension measurement program, and semiconductor manufacturing system
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Application No.: US16957480Application Date: 2019-07-04
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Publication No.: US11600536B2Publication Date: 2023-03-07
- Inventor: Yutaka Okuyama , Takeshi Ohmori , Yasutaka Toyoda
- Applicant: Hitachi High-Tech Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Tech Corporation
- Current Assignee: Hitachi High-Tech Corporation
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge, P.C.
- International Application: PCT/JP2019/026595 WO 20190704
- International Announcement: WO2020/121564 WO 20200618
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01J37/26 ; G05B19/048 ; H01L21/67 ; G01B21/00 ; G06N20/00

Abstract:
The disclosure relates to a dimension measurement apparatus that reduces time required for dimension measurement and eliminates errors caused by an operator. Therefore, the dimension measurement apparatus uses a first image recognition model that extracts a boundary line between a processed structure and a background over the entire cross-sectional image and/or a boundary line of an interface between different kinds of materials, and a second image recognition that output information for dividing the boundary line extending over the entire cross-sectional image obtained from the first image recognition model for each unit pattern constituting a repetitive pattern, obtains coordinates of a plurality of feature points defined in advance for each unit pattern, and measures a dimension defined as a distance between two predetermined points of the plurality of feature points.
Public/Granted literature
- US20220139788A1 DIMENSION MEASUREMENT APPARATUS, DIMENSION MEASUREMENT PROGRAM, AND SEMICONDUCTOR MANUFACTURING SYSTEM Public/Granted day:2022-05-05
Information query
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