Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17384424Application Date: 2021-07-23
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Publication No.: US11600540B2Publication Date: 2023-03-07
- Inventor: Jun Takaoka
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agent Gregory M. Howison
- Priority: JP2018-190197 20181005
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L29/08 ; H01L29/739

Abstract:
A semiconductor device includes a semiconductor layer of first-conductivity-type that has a main surface and that includes an active region set at the main surface, a current detection region set at the main surface away from the active region, and a boundary region set in a region between the active region and the current detection region at the main surface, a first body region of second-conductivity-type formed in a surface layer portion of the main surface at the active region, a first trench gate structure formed in the main surface at the active region, a second body region of second-conductivity-type formed in the surface layer portion of the main surface at the current detection region, a second trench gate structure formed in the main surface at the current detection region, a well region of second-conductivity-type formed in the surface layer portion of the main surface at the boundary region, and a dummy trench gate structure formed in an electrically floating state in the main surface at the boundary region.
Public/Granted literature
- US20210351091A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-11-11
Information query
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